Heat Sinks

tungsten copper, molybdenum copper heat sinksTorrey Hills’ heat sinks manufacturing facility specializes in the R&D and production of high-tech electronic packaging materials, namely Copper tungsten (WCu, CuW), Molybdenum copper (MoCu, CuMo), and copper molybdenum copper (Cu/Mo/Cu) heat sinks and shims. The facility is top in the field of electronic packaging materials with advanced material manufacture technologies, complete materials detective devices and modern management system.

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc. Here is what our customers say about us!


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  • RF and Microwave Packages
  • Power Electronics Packaging (White Paper)
  • Laser Diode Packages (White Paper)
  • Opto Packages
  • Thermal Spreaders (Submounts)
  • HTCC
  • LTCC
  • Simulation


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NEW - Copper Tungsten Heat Sinks Off The Shelf - click here for prices

copper tungsten heat sinks off the shelfCopper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.

All off-the-shelf part prices are listed on this website, plain and simple, so that you can compare them with others to make an easy and confident purchasing decision. In addition to simplifying the buying process, we also guarantee the performance and quality of our product and stand behind the stature of our company.

Click here for more information on off-the-shelf copper tungsten heat sink products.