Cu/Mo70Cu/Cu Heat Sinks (CPC)

Cu/Mo70Cu/Cu heat sinks (CPC)Cu/Mo70Cu/Cu (CPC) is a sandwiched composite similar to Cu/Mo/Cu comprising a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu Mo70Cu and Cu layers is 1:4:1. It has different CTEs in the X and the Y direction. Its thermal conductivity is higher than those of W/Cu, Mo/Cu, Cu/Mo/Cu and it is much cheaper.

Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc. Here is what our customers say about us!

Advantages

  • Large size sheets available (length up to 400mm, width up to 200mm)
  • More easily to be stamped into components than CMC
  • Very strong interface bonding that can resist 850°C heat shock repeatedly
  • Higher thermal conductivity and lower cost
  • No magnetism

Technical Data

Cu/Mo70Cu/Cu

Density (g/cm3)

CTE (ppm/K)

Thermal Conductivity (W/m.K)

X Direction

Y Direction

In-Plane

Thru-Thickness

1:4:1

9.46

7.2

9.0

340

300