Torrey Hills Technologies, LLC Launches New iPhone App “Thermalytics” to Predict Die Junction Temperature
FOR IMMEDIATE RELEASE
( San Diego, CA, October 25, 2011) -- Torrey Hills Technologies, LLC today announced the launch of iPhone app “Thermalytics,” an application that predicts the temperature from the base through the stack of materials. Based on thermal conductivity, size of the layers and die attach method, this application predicts the die junction temperature.
Users can download the app for free during the launch. After entering the number of layers and setting other preferences, users may input such information as die dimensions, heat sink dimensions, attach thickness, attach thermal conductivity, power dissipated, and heat sink temperature. The app then does the calculation and shows the predicted die junction temperature. Users may use this program as a simulation tool to decide on the choice of materials and dimensions.
“We are very excited about the launch of ‘Thermalytics’,” said Joyce Zhang, Marketing Manager of Torrey Hills Technologies, LLC. “We hope this app will turn out to be a useful gadget for packaging engineers, professors and engineering students alike. It adds value to their everyday work.”
Torrey Hills Technologies, LLC (http://www.torreyhillstech.com) is a leader in developing and delivering quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to large-scale furnace equipment for semiconductor packaging, circuit board assembly, advanced materials processing and solar cell (silicon, thin film, and 3rd generation dye sensitized solar cells) manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.