Torrey Hills Technologies, LLC Launches Line of Standard Off-the-Shelf W-Cu Heat Sinks
FOR IMMEDIATE RELEASE
( San Diego, CA, November 1, 2010) -- Torrey Hills Technologies, LLC today announced the launch of 9 standard off-the-shelf heat sinks made from copper tungsten alloy with 75% to 90% tungsten content by weight. They are widely used in hermetic packages, RF packages, opto packages, TO254 and TO257 packages. The company also offers plating options of either 80μ” of Ni or 100 μ” Au over 100 μ” min Ni.
These standard off-the-shelf heat sinks are manufactured at the company’s ISO9001-2000 certified facility and are now in stock and available from its warehouse located in San Diego, CA. All part prices are listed on the company’s website, so that customers can make easy and confident purchasing decisions. For more information regarding standard off-the-shelf heat sinks applications and drawings, please visit http://www.torreyhillstech.com/cots.html.
“Seeing increasing demand for some of the most popular W-Cu heat sinks, we believe it’s the right time to introduce our standard off-the-shelf heat sinks. Standardization allows us to lower our already competitive price, 30% to 50% lower than the market price, and to offer even faster delivery”, added Ken Kuang, President of Torrey Hills Technologies. “The lead time for our customized heat sinks is only 4 weeks compared to the 9 weeks quoted by other competitors. Now customers can even buy our ready to ship standard heat sinks with zero lead time; this is a great plus.”
Torrey Hills will also showcase its standard off-the-shelf heat sinks at IMAPS 2010 - 43rd International Conference and Exhibition on Microelectronics, to be held at the Raleigh Convention Center, Research Triangle, North Carolina from October 31 to November 4 this year. Visitors are welcome to stop by the company’s booth # 620.
About Torrey Hills Technologies, LLC
Torrey Hills Technologies, LLC (http://www.torreyhillstech.com) is a leader in developing and delivering quality yet affordable equipment and supplies for multiple industries. Since its establishment, the company has expanded its business from microelectronics packaging components to large-scale furnace equipment for semiconductor packaging, circuit board assembly, advanced materials processing and solar cell (silicon, thin film, and 3rd generation dye sensitized solar cells) manufacturing. Headquartered in San Diego, Calif., the company now has customers located around the world in North America, South America, Europe, Asia, and Australia.